MONDRAGON ASSEMBLY LAUNCHES NEW IC TOOL
29 June, 2016
Spain-based Mondragon Assembly is introducing a new automatic interconnection (bussing) IC machine.
As a number of busbars in a standard PV cell increases, the bussing or interconnection soldering process is becoming a bottleneck in many production lines, and requires more and more attention from technology providers. And considering the increasing capacity of new stringers and laminators, it is necessary to ensure that bussing technologies will be able to keep up.
Mondragon Assembly says its newly developed machine cas satisfy the demand for higher interconnection capacity. The tool is said to process cells with up to six busbars and reach up to 150 MW of production capacity in a single machine.